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data sheet svs series solid tantalum capacitor document no. ec0062ej6v0ds00 (6th edition) date published february 1998 m printed in japan the svs series is a line-up of high performance ultra miniaturized tantalum chip capacitors. the case dimensions are 2.0 mm 1.25 mm 1.2 mm as shown below. features a the smallest molded chip tantalum capacitor (half size of the eia standard a case) a available up to 10 m f with case dimension of 2.0 mm 1.25 mm 1.2 mm (case code p) applications a portable stereos a vcr cameras a hearing aids dimensions surface mount resin molded, ultra miniaturized chip 1992 ( 1996 ) 1.25 0.2 2.0 0.2 1.2 max. (unit : mm) 0.9 0.1 0.5 0.2 0.5 0.2 the information in this document is subject to change without notice.
2 svs series product line-up and marking code 2.5 4 6.3 10 16 0.33 cn 0.47 cs 0.68 aw cw 1jaaaca 1.5 ge je ae 2.2 ej gj jj aj 3.3 en gn jn an 4.7 es gs js 6.8 ew gw jw 10 7ea 7ga 7ja u r (vdc) capacitance ( m f) u r : rated voltage part number system [bulk] [tape & reel] marking detail svs p 0j 105 m te svsp0j105m 8 r ? polarity mark ? polarity mark feed direction tape tape r : (standard) orientation l : (non-standard) orientation feed direction capacitance tolerance 20% packing orientation tape and reel tape width 8 mm part number of bulk (see left) capacitance code in pf first two digits represent significant figures. third digit specifies number of zeros to follow. rated voltage 0e : 2.5 v, 0g : 4 v, 0j : 6.3 v 1a : 10 v, 1c : 16 v case code svs series j a production date code (indicated by dots) marking code (corresponding to rated voltage and capacitance) polarity implement date code on trial. + up to 6.8 f m 10 f m ** ** 7 j a
3 svs series ratings rated voltage (vdc) 2.5 4 6.3 10 16 capacitance ( m f) 2.2 3.3 4.7 6.8 10 1.5 2.2 3.3 4.7 6.8 10 1 1.5 2.2 3.3 4.7 6.8 10 0.68 1 1.5 2.2 3.3 0.33 0.47 0.68 1 tangent of loss angle 0.1 0.1 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.1 0.1 0.1 0.2 leakage current ( m a) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.6 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 part number svsp0e225m svsp0e335m svsp0e475m svsp0e685m svsp0e106m svsp0g155m svsp0g225m svsp0g335m svsp0g475m svsp0g685m svsp0g106m svsp0j105m svsp0j155m svsp0j225m svsp0j335m svsp0j475m svsp0j685m svsp0j106m svsp1a684m svsp1a105m svsp1a155m svsp0a225m svsp0a335m svsp1c334m svsp1c474m svsp1c684m svsp1c105m
4 svs series specifications no. items 1 operating temp. range 2 rated voltage 3 surge voltage 4 derated voltage 5 capacitance range 6 capacitance tolerance 7 leakage current 8 tangent of loss angle 9 surge voltage resistance temp. c /c tangent of loss angle leakage current 11 rapid change of temperature 12 resistance to soldering 13 damp heat (steady state) 14 endurance 15 failure rate specifications C55 to +125?c 2.5 4 6.3 10 16 vdc 3.3 5.2 8 13 20 vdc 1.6 2.5 4 6.3 10 vdc 0.33 to 10 m f 20% 0.5 m a max. 0.1 max. / 0.2 max. (refer to ratings) c /c : 20% tangent of loss angle : initial requirement leakage current : initial requirement C55?c +85?c +125?c %% % 150% of initial initial 150%of initial requirement requirement requirement 0.1 cv or 5 m a 0.125 cv or 6.25 m a CC whichever is whichever is greater greater c /c : 20% tangent of loss angle : initial requirement leakage current : initial requirement c /c : 20% tangent of loss angle : initial requirement leakage current : initial requirement c /c : 20% tangent of loss angle : 150% of intial requirement leakage current : initial requirement c /c : 20% tangent of loss angle : initial requirement leakage current : 200% of initial requirement l 0 = 1% / 1 000 h test conditions over 85?c, applied voltage shall be derated on the basis of the derated voltage at 125?c specified in this table item no.4. up to 85?c up to 85?c at 125?c at 120 hz at 120 hz 5 min. after rated voltage applied at 25?c, 120 hz at 85?c surge voltage for 30 sec. (rs = 1 k w ) discharge for 5 min. 30 sec. 1 000 cycles step1 : +25?c step2 : C55?c step3 : +25?c step4 : +85?c step5 : +125?c step6 : +25?c iec68-2-14 test n and iec68-2-33 guidance C55 to +125?c 5 cycles iec68-2-58 test td fully immersion to solder at 260?c for 5 sec iec68-2-3 test ca at 40?c, 90 to 95% rh, for 500h at 85?c & 125?c (derated voltage), rated voltage applied for 2 000 h at 85?c & 125?c (derated voltage), rated voltage applied for 1 000 h 0 C20 +20 0 +20 0 10 c /c : capacitance change ratio d d d d d d d characteris- tics at high and low temperature
5 svs series tape and reel specification [carrier tape specification and packing quantity] a 0 b 0 d 0 feed direction sprocket hole embossed cavity p 1 e f w t k p 2 p 0 a 0 0.2 1.4 b 0 0.2 2.2 w 0.3 8.0 f 0.05 3.5 e 0.1 1.75 p 1 0.1 4.0 p 2 0.05 2.0 p 0 0.1 4.0 d 0 f 1.5 k 0.2 1.4 t 0.2 q'ty/reel 3000 (unit : mm) tape width 8 (unit : mm) a f 178 2.0 n f 50 min. c f 13 0.5 d f 21 0.5 b 2.0 0.5 w 1 10.0 1.0 w 2 14.5 max. r 1 w 2 cna d b r w 1 [reel specification] +0.1 0
6 svs series characteristics data 30 20 10 0 ?0 ?0 ?0 c / c (%) d 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 25?c ?5?c 25?c 2.5 v / 2.2 f m 85?c 125?c 25?c leakage current ( a) m 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 25?c ?5?c 25?c 6.3 v / 1 f m 85?c 125?c 25?c leakage current ( a) m 30 20 10 0 ?0 ?0 ?0 c / c (%) d characteristics at high and low temperature
7 svs series 15 10 5 0 ? ?0 ?5 c / c (%) d 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 initial 2.5 v / 2.2 f m final leakage current ( a) m 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 initial 6.3 v / 1 f m final leakage current ( a) m 15 10 5 0 ? ?0 ?5 c / c (%) d resistance to soldering (immersing for 10 sec. at 260?c) (reference data)
8 svs series 15 10 5 0 ? ?0 ?5 c / c (%) d 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 0 h 2.5 v / 2.2 f m 500 h 1 000 h 0 h 500 h 1 000 h leakage current ( a) m 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 6.3 v / 1 f m leakage current ( a) m 15 10 5 0 ? ?0 ?5 c / c (%) d damp heat, steady state (65?c, 90 to 90% rh) (reference data)
9 svs series 30 20 10 0 ?0 ?0 ?0 c / c (%) d 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 0 h 2.5 v / 2.2 f m 500 h 1 000 h 0 h 500 h 1 000 h leakage current ( a) m 0.08 0.06 0.04 0.02 0 tangent of loss angle (tan ) d 0.1 0.01 0.001 6.3 v / 1 f m leakage current ( a) m 30 20 10 0 ?0 ?0 ?0 c / c (%) d endurance (85?c, rated voltage 1.3 applied) (reference data)
10 svs series impedance C frequency characteristics (reference data) 10 k 100 k frequency (hz) 1 m 10 m 1 k 1 10 z ( ) 100 1 k 6.3 v/1 f m
11 svs series guide to applications for tantalum chip capacitors the failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage current mode. refer to the following for reliable circuit design. 1. expecting reliability svs series tantalum chip capacitors are typically applied to decoupling, blocking, bypassing and filtering. the svs series has a very high reliability (low failure rate) in the field. for example, the maximum field failure rate of an svs series capacitor with a dc rated voltage of 16 v is 0.0004% / 1000 hour (4 fit) at an applied voltage of 5 v, operating temperature of 25?c and series resistance of 3 w . the maximum failure rate in the field is estimated by the following expression : l : maximum field failure rate l 0 : 1%/1000 hour (the failure rate of the svs series at the full dc rated voltage at operating tempera ture of 85?c and series resistance of 3 w .) v : applied voltage in actual use v 0 : dc rated voltage t : operating temperature in actual use t 0 : 85?c 120 10 2 7 4 2 10 1 7 4 2 10 0 7 4 2 10 ? 7 0.2 0.1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 4 2 10 ? 7 4 2 10 ? 7 4 2 10 ? 7 4 2 10 ? 110 100 90 operating temperature t (?c) failure rate multiplier f applied voltage ratio v/ v 0 80 70 60 50 40 30 20 the nomograph is provided for quick estimation of maximum field failure rates. connect operating temperature t and applied voltage ratio v/ v 0 of interest with a straight line. the failure rate multiplier f is given at the inter- section of this line with the model scale. the failure rate is obtained as l = l 0 f. examples : given v/ v 0 = 0.4 and t = 45?c. read f = 4 10 ? hence, l = 0.004% / 1000 hour (40 fit). given v/ v 0 = 0.3 and t = 25?c, read f = 4 10 ? hence, l = 0.0004% / 1000 hour (4 fit). v v 0 l = l 0 3 2 t-t 0 10
12 svs series 2. series resistance as shown in figure 1, reliability is increased by inserting a series resistance of at least 3 w / v into circuits where current flow is momentary (switching circuits, charge/discharge circuits, etc). if the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to 1/3 of the dc rated voltage. 3. ripple voltage the sum of dc voltage and peak ripple voltage should not exceed the dc rated voltage of the capacitor. figure 2 is based on an ambient temperature of 25?c. for higher temperature, permissible ripple voltage shall be derated as follows. permissible voltage at 50?c = 0.7 permissible voltage at 25?c permissible voltage at 85?c = 0.5 permissible voltage at 25?c permissible voltage at 125?c = 0.3 permissible voltage at 25?c 4. reverse voltage because the capacitors are polarized, reverse voltage should not be applied. if reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very short time and should not exceed the following. 10% of dc rated voltage at 25?c 5% of dc rated voltage at 85?c 1% of dc rated voltage at 125?c 0.1 1 frequency (khz) figure 2 permissible ripple voltage vs. frequency 10 0.1 1 10 ripple voltage (vrms) 100 100 16 v case : p @ 25?c 10 v 6.3 v 4 v 2.5 v 10 1 magnification of failure 0.1 0.1 1 series resistance ( w /v) figure 1 effects of series resistance 10 100
13 svs series 5. mounting (1) direct soldering keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering: (a) temporarily fixing resin because the svs series solid tantalum capacitors are larger in size and subject to more force than the chip multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum capacitors. however, if too much resin is used, the resin adhering to the patterns on a printed circuit board may adversely affect the solderability. (b) pattern design a b c a case a b c p 2.2 1.4 0.7 the above dimensions are for reference only. if the capacitor is to be mounted by this method, and if the pattern is too small, the solderability may be degraded. (e) temperature and time keep the peak temperature and time to within the following values: solder temperature ....... 260?c max. time ....... 5 seconds max. whenever possible, perform preheating (at 150?c max.) for smooth temperature profile. to maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. (d) component layout if many types of chip components are mounted on a printed circuit board which is to be soldered by means of jet soldering, solderability may not be uniform over the entire board depending on the layout and density of the components on the board (also take into consideration generation of flux gas). (e) flux use resin-based flux. do not use flux with strong acidity.
14 svs series (2) reflow soldering keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate: (a) pattern design (in accordance with iec1182) the above dimensions are recommended. note that if the pattern is too big, the component may not be mounted in place. (b) temperature and time keep the peak temperature and time to within the following values: solder temperature 260?c max. time : 10 seconds max. whenever possible, perform preheating (at 150?c max.) for smooth temperature profile. to maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. the peak temperature and time shown above are applicable when the capacitor is to be soldered in a soldering oven or with a hot plate. when the capacitor is soldered by means of infrared reflow soldering, the internal temperature of the capacitor may rise beyond the surface temperature. (3) using soldering iron when soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron is very difficult. however, it is recommended that the following temperature and time be observed to maintain the reliability of the capacitor: lron temperature 300?c max. time 3 seconds max. iron power 30 w max. x g z case g max. z min. x min. p 0.5 2.6 1.2
15 svs series 6. cleaning generally, several organic solvents are used for flux cleaning of an electronic component after soldering. many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two or more may be used in combination. the temperature of the organic solvent may vary from room temperature to several 10?c, depending on the desired effect. if cleaning is carried out with emphasis placed only on cleaning effect, however, the marking on the electronic component cleaned may be erased, the appearance of the com- ponent may be damaged, and in the worst case, the component may be functionally damaged. it is therefore recommended that the svs series solid tantalum capacitor be cleaned under the following conditions: [recommended conditions of flux cleaning] (1) cleaning solvent chlorosen, isopropyl alcohol (2) cleaning method shower cleaning, rinse cleaning, vapor cleaning (3) cleaning time 5 minutes max. * ultrasonic cleaning this cleaning method is extremely effective for eliminating dust that has been generated as a result of me- chanical processes, but may pose a problem depending on the condition. as a result of an experiment conducted by nec, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning machines. the cause of this phenomenon is considered metal fatigue of the capacitor termi- nals that occurred due to ultrasonic cleaning. to prevent the terminal from being cut, decreasing the output power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. however, it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conver- sion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned, and the securing states of the components on the boards. it is therefore recommended that ultrasonic cleaning be avoided as much as possible. if ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the cleaning. for further information, consult nec. 7. others (1) do not apply excessive vibration and shock to the capacitor. (2) the solderability of the capacitor may be degraded by humidity. store the capacitor at (C5 to +40?c) room temperature and (40 to 60% rh) humidity. (3) exercise care that no external force is applied to the tape packaged products (if the packaging material is deformed, the capacitor may not be automatically mounted by a chip mounter).
svs series no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents. copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its electronic conponents, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec electronic conponents, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: standard, special, and specific. the specific quality grade applies only to devices developed based on a customer designated quality assurance program for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafis, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is standard unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. anti-radioactive design is not implemented in this product.

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